Hyperscale Data Centres
AI, cloud, and high-density compute environments.
From Chip to Chiller Delivering Efficient Liquid Cooling
Less Power
Improve cooling efficiency and reduce energy consumption.
Less CO₂
Lower carbon emissions through efficient
thermal management.
Less Water
Reduced Dependence on Water-Intensive cooling Systems
More Compute
Support higher rack densities with reliable thermal performance.
Featured in
Engineered for Precision Hotspot Removal in XPUs
Precision Thermal Engineering
Precision hotspot removal for XPUs at scale.
Patented Mesh Flow Architecture
Optimized coolant distribution beyond conventional cold plates.
Modular Cooling Infrastructure
Built to scale with evolving compute demands.
AI Native Thermal Intelligence
Continuous optimization across the complete Chip to Chiller ecosystem.
Rear Door Heat Exchanger
RDHx ProSeries
The KühlTherm RDHx ProSeries captures heat directly at the rear of the rack before it enters the data centre environment. Designed for high density AI and GPU infrastructure, it reduces the need for major facility changes and improves overall cooling efficiency.
Built on a patented modular architecture scaling from 20 kW to 100 kW per door, the system uses variable speed fans and built-in redundancy to adapt to real time thermal load. This enables higher rack densities, simplified deployment, and improved operational efficiency.
Explore Solutions(RDHx)
Cooling Distribution Unit
Precision Coolant Distribution
The KühlTherm Coolant Distribution Unit sits between facility water and liquid cooling infrastructure, delivering precise coolant flow, temperature control, and pressure management for reliable thermal performance.
Engineered in modular blocks scaling from 250 kW to 1.5 MW per row, the CDU combines built-in redundancy with leak-free connections for continuous, uninterrupted operation. This supports both current infrastructure and future capacity growth.
Explore Solutions(CDU)
Direct Liquid Cooling
Cold Plate Cooling System
The KühlTherm Direct Liquid Cooling system removes heat directly from CPUs and GPUs using patented Mesh Cold Plate technology co-engineered around the thermal profile of modern processors, enabling precise hotspot removal where compute demands are highest.
Delivering 300 W to 2,500 W of cooling capacity per plate and built for rack densities beyond 100 kW, it integrates with the full KühlTherm ecosystem to support higher compute densities and greater infrastructure efficiency.
Explore Solutions(DLC)
Nexus Flow
The Intelligence Layer Data Centres Never Had.
NexusFlow OS combines thermal and power intelligence into a unified AI-native platform, delivering complete visibility, predictive optimization, and autonomous orchestration across your liquid cooling infrastructure
Chip-to-Chiller Intelligence
Complete thermal visibility from chip to chiller, optimizing every stage of heat transfer.
Grid-to-Rack Intelligence
End-to-end visibility across the entire power chain, from grid to rack.
Autonomous Cooling Control
Continuously optimizes cooling parameters to match real-time infrastructure demands.
AI-Powered Load Prediction
Predicts thermal demand before workloads change, enabling proactive cooling optimization.
Built For
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Colocation Facilities
Scalable liquid cooling for multi-tenant infrastructure.
Edge Data Centres
Compact, efficient cooling for distributed deployments.
Built Around Innovation.
KühlTherm builds full-stack liquid cooling systems that redefine thermal performance and scalability for AI infrastructure — powered by patented technology and relentless R&D
India's First Liquid Cooling Validation Lab
Advanced testing and simulation capabilities that validate thermal performance, optimize cooling efficiency, and accelerate product innovation.
